SI PI Thermal co-simulations for enhanced board performance
Ms. Savita R Ganjigatti – VP Engineering – PWB Design & Analysis, SIENNA ECAD Technologies Pvt. Ltd., Bengaluru.
Decades ago, the challenge was only thermal, designs were going through thermal analysis. Frequency started becoming an issue as increased from KHz to MHz, Signal Integrity simulations started. The industry was happy & comfortable, challenges started when we entered Giga Hz Era. ONLY Signal Integrity was in efficient. Then the Power effects, EMC effects started affecting Integrity of the signal.
PCB Defluxing: Cost-effective and modern alternatives for IPA
Mr. Manish Agrawal, Mectronics Marketing Services, India.
In most Western electronic manufacturing sites cleaning with Isopropanol (IPA) or Ethanol (alcohol) in different applications such as PCB, stencil and reflow oven cleaning has been replaced by much more modern cleaning technologies. In Asia, however, most companies are still employing such chemicals, although there are many more cost-effective and safe alternatives available
Spice Analysis to ensure Reliable and Optimal Analog PCB Design
Mr. Alok Tripathi, Product Engineering Architect & Mr. Taranjit Kukal Senior Architect, Product Engineering, Cadence Design Systems, Inc.
The paper describes method of using results of functional spice simulations for reliable PCB design for power-electronics applications. PCBs are sent to labs for smoke, safety and EMC compliance tests and any failure leads to re-spins and usually non-optimal fixes. The proposed methodology ensures correct-by-design approach where spice-simulation data can be post-processed to drive PCB implementation with proper component selection and layout.
Thick film Hybridization of Indigenously Developed “10W DC-DC Converter” for Satellite Power Distribution Systems
Ms. Anju Singh – Scientist/Engineer, U R Rao Satellite Centre, ISRO, Bengaluru.
Thick film technology based Hybrid Microcircuits (HMCs) have become the assembly of choice over Surface Mount Technology (SMT) based electronics for several of its prominent advantages for miniaturization. Hybrid DC-DC converters are the miniaturized power supplies fabricated using Thick film technology with active dice, passive chip components & magnetics attached on a ceramic substrates then housed into a hermetic package.
Reliability & Quality Assurance – ESD Online Continuous Monitoring System
Ms. Pratima Mehta – Senior Software Engineer – Test Engineering & Industrialization.
Despite a great deal of effort during the past decade, Electrostatic Discharge (ESD) still affects production yields, manufacturing costs, product quality, product reliability, and profitability. The cost of damaged devices themselves ranges from only a few cents for a simple diode to several hundred dollars for complex hybrids. When associated costs of repair and rework, shipping, labor, and overhead are included, clearly the opportunities exist for significant improvements against ESD.
Reliability Study of Inductor Coils in Electronic Device
Ms. Vasudha M A – Assistant Manager – Quality, Rakon India Private Limited
In today’s high reliability electronics industry, the demand on the performance of the electronic devices and their components is ever increasing.
This paper aims at analyzing and confirming the reliability performance of copper coils in an inductor. The Paper focuses on conditions for electrical and visual failure, experimental results and also on suggestions to mitigate the failure
Manufacturing Quality Assurance: Applicability of different techniques
Ms. Seema Sabikhi – Sr. Engineer – Process Quality, Barco Electronic Systems (P) Ltd.
Quality can be defined as fulfilling specification or customer requirement, without any defect. A product is said to be high in Quality if it is functioning as expected and reliable.
Manufacturing process control and quality assurance are elements of a quality management system, which is the set of policies, procedures, and processes used to ensure the quality of a product or a service.
Space Qualified PCB Design Techniques
Mr. D J Bhatt – Engineer/Scientist, Space Application Centre (ISRO)
Today’s Printed Circuit Board (PCB) design challenges are not only confined to terrestrial PCB designs but also extended to more prominent and critical Space-grade PCB. There are additional challenges due to the Space environment and requirement of achieving high-reliability PCBs beyond Class-3 with failure risk less than 0.001%.
This paper describes Space-grade PCB design issues, design flow, design guidelines, and techniques. It also explains PCB design issues and critical tasks necessary for ensuring reliable Space qualified PCB.
Tin Plating Detection & Tin Whisker Mitigation
Mr. G S Sathya Narayana – Sr. DGM, Process Engineering Department, Electronic Warfare & Avionics, BEL
Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from the surface of tin and tin alloy plating, when tin is used as a final finish. Whiskers can cause short circuits and arc in electrical equipment.
Proactive Design for eXcellence process for High-Speed Boards
Mr. Amba Prasad – Product Architect, Tejas Networks
Printed Wiring Boards used for High-Speed Electronic Packaging are building blocks for high-performance Communication equipment, are often product of contradicting performance requirements. Implementation of a design requirement will have a direct impact on other related product performance parameters.
Reinvigorating Product Strategy
Mr. Peter Yu – Senior Director of Strategy & Marketing, MULTEK
Product Strategy is core to any company’s success. How can organizations launch successful new products, extend the lifecycle of existing lucrative products, or turn under-performing products into stellar ones? This paper will show, how today’s shifting market and technology trends offer truly disruptive opportunities to those who “connect the dots” – including how PCB manufacturers can help.