Thick film Hybridization of Indigenously Developed “10W DC-DC Converter” for Satellite Power Distribution Systems
Ms. Anju Singh – Scientist/Engineer, U R Rao Satellite Centre, ISRO, Bengaluru.
Thick film technology based Hybrid Microcircuits (HMCs) have become the assembly of choice over Surface Mount Technology (SMT) based electronics for several of its prominent advantages for miniaturization. Hybrid DC-DC converters are the miniaturized power supplies fabricated using Thick film technology with active dice, passive chip components & magnetics attached on a ceramic substrates then housed into a hermetic package.
Reliability Study of Inductor Coils in Electronic Device
Ms. Vasudha M A – Assistant Manager – Quality, Rakon India Private Limited
In today’s high reliability electronics industry, the demand on the performance of the electronic devices and their components is ever increasing.
This paper aims at analyzing and confirming the reliability performance of copper coils in an inductor. The Paper focuses on conditions for electrical and visual failure, experimental results and also on suggestions to mitigate the failure
Manufacturing Quality Assurance: Applicability of different techniques
Ms. Seema Sabikhi – Sr. Engineer – Process Quality, Barco Electronic Systems (P) Ltd.
Quality can be defined as fulfilling specification or customer requirement, without any defect. A product is said to be high in Quality if it is functioning as expected and reliable.
Manufacturing process control and quality assurance are elements of a quality management system, which is the set of policies, procedures, and processes used to ensure the quality of a product or a service.
Space Qualified PCB Design Techniques
Mr. D J Bhatt – Engineer/Scientist, Space Application Centre (ISRO)
Today’s Printed Circuit Board (PCB) design challenges are not only confined to terrestrial PCB designs but also extended to more prominent and critical Space-grade PCB. There are additional challenges due to the Space environment and requirement of achieving high-reliability PCBs beyond Class-3 with failure risk less than 0.001%.
This paper describes Space-grade PCB design issues, design flow, design guidelines, and techniques. It also explains PCB design issues and critical tasks necessary for ensuring reliable Space qualified PCB.
Tin Plating Detection & Tin Whisker Mitigation
Mr. G S Sathya Narayana – Sr. DGM, Process Engineering Department, Electronic Warfare & Avionics, BEL
Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from the surface of tin and tin alloy plating, when tin is used as a final finish. Whiskers can cause short circuits and arc in electrical equipment.
Proactive Design for eXcellence process for High-Speed Boards
Mr. Amba Prasad – Product Architect, Tejas Networks
Printed Wiring Boards used for High-Speed Electronic Packaging are building blocks for high-performance Communication equipment, are often product of contradicting performance requirements. Implementation of a design requirement will have a direct impact on other related product performance parameters.
Reinvigorating Product Strategy
Mr. Peter Yu – Senior Director of Strategy & Marketing, MULTEK
Product Strategy is core to any company’s success. How can organizations launch successful new products, extend the lifecycle of existing lucrative products, or turn under-performing products into stellar ones? This paper will show, how today’s shifting market and technology trends offer truly disruptive opportunities to those who “connect the dots” – including how PCB manufacturers can help.