IPC INDIA TECHNICAL ARTICLES



Criteria for selection of SMT Assembly Equipment (Part - 01)

Mr. B J Srinivas – Director, M/s. Kreative Technologies, Bengaluru.


During the past few decades, there has been a rapid technological advancement of component and PCB technology ushering in migration from through-hole to surface mount (SMT). The miniaturization of components and densely packed PCBs has lead to more powerful designs in much smaller packages.

Availability of SMDs has resulted in miniaturisation of PC assemblies and shrinking of the final product size. Surface mount components are easier to process mass assemblies as compared to the use of conventional types of components.


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Criteria for selection of SMT Assembly Equipment (Part - 02)

Mr. B J Srinivas – Director, M/s. Kreative Technologies, Bengaluru.


The SMDs are continually undergoing technological advancements. Due to the miniature size and complexity of components, placement machines are also transforming to meet the handling capabilities of such devices ( See appendix 1 for a partial list of the SMDs in use).

The main function of a SMT placement machine is to ‘Pick and Place’ a surface mount component (SMD) from a feeder to a printed circuit board. Some machines also have an adhesive dispensing system attached as an optional feature. The task of evaluating the needs, selecting the equipment which best meets the needs and to identify the right supplier who can provide a satisfactory ‘After sales support’ is a big exercise.


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A Transient Voltage Suppressors ESD Characterization

Mr. P V N Murthy – Engineer-in-charge, EMI/EMC & ESD Laboratory of Electrical Design & Measurement Division, Systems Integration Group, ISRO.


Electronic systems are becoming increasingly portable and getting miniaturised as a result of advanced integrated circuits, miniaturized power sources and high density I/Os. The flip side to scaling is that it creates ICs that are more susceptible to transient voltages due to thinner oxides and smaller metallization traces. The ideal method of transient voltage suppression is to clamp the transient voltage with a transient voltage suppressor (TVS).


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The new form of insulators for Printed Circuit Boards

Mr. Rakesh Gandadharan, PCB Design Engineer, ELMA Electronics.


Design of PCBs are becoming more and more complex because of the trend to faster, higher integrated, smaller form factors and low power electronics circuits. A number of criteria should be considered to achieve maximum system performance under this condition. This document deals with a new insulator with which the PCB can be integrated into smaller level beyond imaginable and can solve few issues facing in complex design. The main idea of this research is to fabricate modified special type of insulator, which can serve as both insulator cum conductive.


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Test Equipment and Methods – Test automation: PCBA Automated Testing Traceability and Fault Tracking (RFID) System

Mr. Thaneshwar Jaglan, Senior Software Engineer – Test Engineering & Industrialisation, Barco Electronics Systems Pvt. Ltd., Noida


As a PCB board manufacturing organization for high end customers, it becomes our responsibility and requirement to produce very high quality (Class III) products and to ensure that only faultless items reach the customer. The most crucial thing is to test the items with maximum test coverage and keep the traceability records of electronic components and to keep track of all operations performed during manufacturing process.


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☛ Investigative Analysis Of Natural Frequency And Response Variation In Bolted Printed Circuit Boards (PCBs) Subjected To Launch Vibrations

Mr. Mukund kumar Thakur – Scientist, System Integration Group, ISRO Satellite Centre, Bangalore


This paper shall focus on the investigative tests performed on PCBs to map the variation in joint stiffness and associated variation in natural frequency and damping coefficients of the board due to loss of energy in the joints, subjected to random vibration loads. The effect of duration of the test and input G levels on the above parameters is also analyzed.


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☛ Innovative Seam Welding Process For Hermetic Sealing Of Large Periphery Hybrid Microcircuit Packages For Space Application

Mr. Palani P – Hybrid Microcircuits Division, Parts Materials & Process Group ISRO Satellite Centre, Bengaluru


Hermetic seam sealing is the final assembly operation and vital process in HMC fabrication, which is extremely important in maintaining the reliability of the circuit for long periods of time under any adverse environments that the hybrid might encounter.


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☛ SI PI Thermal Co-simulations For Enhanced Board Performance

Ms. Savita R Ganjigatti – VP Engineering – PWB Design & Analysis, SIENNA ECAD Technologies Pvt. Ltd., Bengaluru.


Decades ago, the challenge was only thermal, designs were going through thermal analysis. Frequency started becoming an issue as increased from KHz to MHz, Signal Integrity simulations started. The industry was happy & comfortable, challenges started when we entered Giga Hz Era. ONLY Signal Integrity was in efficient. Then the Power effects, EMC effects started affecting Integrity of the signal.


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☛ PCB Defluxing: Cost-effective And Modern Alternatives For IPA

Mr. Manish Agrawal, Mectronics Marketing Services, India.


In most Western electronic manufacturing sites cleaning with Isopropanol (IPA) or Ethanol (alcohol) in different applications such as PCB, stencil and reflow oven cleaning has been replaced by much more modern cleaning technologies. In Asia, however, most companies are still employing such chemicals, although there are many more cost-effective and safe alternatives available


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☛ Spice Analysis To Ensure Reliable And Optimal Analog PCB Design

Mr. Alok Tripathi, Product Engineering Architect & Mr. Taranjit Kukal, Senior Architect, Product Engineering, Cadence Design Systems, Inc.


The paper describes method of using results of functional spice simulations for reliable PCB design for power-electronics applications. PCBs are sent to labs for smoke, safety and EMC compliance tests and any failure leads to re-spins and usually non-optimal fixes. The proposed methodology ensures correct-by-design approach where spice-simulation data can be post-processed to drive PCB implementation with proper component selection and layout.


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☛ Thick Film Hybridization Of Indigenously Developed “10W DC-DC Converter” For Satellite Power Distribution Systems

Ms. Anju Singh – Scientist/Engineer, U R Rao Satellite Centre, ISRO, Bengaluru.


Thick film technology based Hybrid Microcircuits (HMCs) have become the assembly of choice over Surface Mount Technology (SMT) based electronics for several of its prominent advantages for miniaturization. Hybrid DC-DC converters are the miniaturized power supplies fabricated using Thick film technology with active dice, passive chip components & magnetics attached on a ceramic substrates then housed into a hermetic package.


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☛ Reliability & Quality Assurance – ESD Online Continuous Monitoring System

Ms. Pratima Mehta – Senior Software Engineer – Test Engineering & Industrialization, Barco Electronic Systems (P) Ltd, Noida, UP.


Despite a great deal of effort during the past decade, Electrostatic Discharge (ESD) still affects production yields, manufacturing costs, product quality, product reliability, and profitability. The cost of damaged devices themselves ranges from only a few cents for a simple diode to several hundred dollars for complex hybrids. When associated costs of repair and rework, shipping, labor, and overhead are included, clearly the opportunities exist for significant improvements against ESD.


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☛ Reliability Study Of Inductor Coils In Electronic Device

Ms. Vasudha M A – Assistant Manager – Quality, Rakon India Pvt. Ltd.


In today’s high reliability electronics industry, the demand on the performance of the electronic devices and their components is ever increasing.

This paper aims at analyzing and confirming the reliability performance of copper coils in an inductor. The Paper focuses on conditions for electrical and visual failure, experimental results and also on suggestions to mitigate the failure


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☛ Manufacturing Quality Assurance: Applicability of Different Techniques

Ms. Seema Sabikhi – Sr. Engineer – Process Quality, Barco Electronic Systems (P) Ltd.


Quality can be defined as fulfilling specification or customer requirement, without any defect. A product is said to be high in Quality if it is functioning as expected and reliable.

Manufacturing process control and quality assurance are elements of a quality management system, which is the set of policies, procedures, and processes used to ensure the quality of a product or a service.


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☛ Space Qualified PCB Design Techniques

Mr. D J Bhatt – Engineer/Scientist, Space Application Centre (ISRO).


Today’s Printed Circuit Board (PCB) design challenges are not only confined to terrestrial PCB designs but also extended to more prominent and critical Space-grade PCB. There are additional challenges due to the Space environment and requirement of achieving high-reliability PCBs beyond Class-3 with failure risk less than 0.001%.

This paper describes Space-grade PCB design issues, design flow, design guidelines, and techniques. It also explains PCB design issues and critical tasks necessary for ensuring reliable Space qualified PCB.


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☛ Tin Plating Detection & Tin Whisker Mitigation

Mr. G S Sathya Narayana – Sr. DGM, Process Engineering Department, Electronic Warfare & Avionics, BEL


Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from surface of tin and tin alloy plating, when tin is used as a final finish. Whiskers can cause short circuits and arcing in electrical equipments.

This paper describes in detail the Tin plating detection & Tin Whisker Mitigation method adopted in EW&A/BEL to effectively reduce the Tin Whisker growth.


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☛ Proactive Design For eXcellence process For High-Speed Boards

Mr. Amba Prasad – Product Architect, Tejas Networks.


Printed Wiring Boards used for High-Speed Electronic Packaging are building blocks for high-performance Communication equipment, are often product of contradicting performance requirements. Implementation of a design requirement will have a direct impact on other related product performance parameters.


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☛ Reinvigorating Product Strategy

Mr. Peter Yu – Senior Director of Strategy & Marketing, MULTEK


Product Strategy is core to any company’s success. How can organizations launch successful new products, extend the lifecycle of existing lucrative products, or turn under-performing products into stellar ones? This paper will show, how today’s shifting market and technology trends offer truly disruptive opportunities to those who “connect the dots” – including how PCB manufacturers can help.


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